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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LHRF5733-PF/TBF-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LHRF5733-PF/TBF-X C 11 - Apr. - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X Page 1/7
Package Dimensions
P2
H
H2 W2 H1 H L W0 W1 W3
D
P1 P
F
T
LHRF5733-PF
7.1 2.4
7.8 1.5MAX 25.0MIN 2.5
1/4
0.5 TYP
1.0MIN 2.54TYP
+Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X Page 2/7
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol HRF Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 90 75 10 2000 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
g A V J J
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 J)
PART NO
MATERIAL Emitted
COLOR
Luminous Forward Dominant Spectral intensity voltage wave halfwidth @20mA(V) @20mA(mcd) length f nm f Dnm
Viewing angle 2c 1/2 (deg)
Lens
Min. Max. Min.
Typ.
LHRF5733-PF/TBF-X
AlGaInP
Red
Water Clear
630
20
1.5
2.4
120
220
116
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X
E Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
------------------
Page 3/7
Minimum mm inch
0.15 0.19
-------
Maximum mm
4.2 5.8 2.0
inch
0.17 0.23 0.08
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
3.8 4.8
-------
H H
Height Of Seating Plane
-------
15.5
17.5 19.0 22.5 25.5 21.5
0.61
0.69 0.75 0.89 1.0 0.85 0.8 0.67 0.79 0.74 0.94 0.83
-------
16.5
19.5 21.0 24.5 26.5 22.5 21.2 21.125 22.5 19.8 26.0 23.0 36 11
0.65
0.77 0.83 0.96 1.04 0.89 0.83 0.83 0.89 0.78 1.02 0.91 1.42 0.43 0.51 0.18 0.3 0.06 0.38 0.61 0.16 0.75
TBF-1 TBF-2 TBF-3 TBF-4 TBF-5
Feed Hole To Bottom Of Component
TBF-6 TBF-7 TBF-8 TBF-10 TBF-11 TBF-12
H1
20.2 17.125 20.0 18.8 24.0 21.0
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
H2 L P P1 P2 T W0 W1 W2 W3
-------
W0 12.4 3.15 5.1
-------
0.49 0.12 0.2
-------
13 4.55 7.7 1.42 9.75 15.5 4.0 19
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBF = Tape And Box Forming Leads
E Dimensions Symbol Information
Specification Description Symbol minimum mm Overall Length Overall Width Overall Thickness L W H 330 265 50 inch 13.0 10.4 1.97 maxmum mm 340 275 60 inch 13.4 10.8 2.4
E Package Dimensions
W
L
H
Part No.
LHRF5733-PF/TBF-X
Quantity/Box 2000PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X
E Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
------------------
Page 4/7
Minimum mm inch
0.15 0.19
-------
Maximum mm
4.2 5.8 2.0
inch
0.17 0.23 0.08
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
3.8 4.8
-------
Height Of Seating Plane
-------
H H
15.5
19.0 21.7 22.5 17.5 18.5
0.61
0.75 0.85 0.89 0.69 0.73 0.81 1.00 0.81 0.98 0.87 0.98
-------
16.5
20 23.7 23.5 18 19.5 21.5 27.5 22.5 27.0 23.0 26.0 36 11
0.65
0.79 0.93 0.93 0.71 0.77 0.85 1.08 0.89 1.06 0.91 1.02 1.42 0.43 0.51 0.18 0.3 0.06 0.38 0.61 0.16 0.75
TBF-13 TBF-14 TBF-15 TBF-16 TBF-17
Feed Hole To Bottom Of Component
TBF-18 TBF-19 TBF-20 TBF-21 TBF-22 TBF-23
H1
20.5 25.5 20.5 25.0 22.0 25.0
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
H2 L P P1 P2 T W0 W1 W2 W3
-------
W0 12.4 3.15 5.1
-------
0.49 0.12 0.2
-------
13 4.55 7.7 1.42 9.75 15.5 4.0 19
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBF = Tape And Box Forming Leads
E Dimensions Symbol Information
Specification Description Symbol minimum mm Overall Length Overall Width Overall Thickness L W H 330 265 50 inch 13.0 10.4 1.97 maxmum mm 340 275 60 inch 13.4 10.8 2.4
E Package Dimensions
W
L
H
Part No.
LHRF5733-PF/TBF-X
Quantity/Box 2000PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X Page5/7
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
3.0 2.5 2.0 1.5 1.0 0.5 0
10 1.0
0.1 1.0 1.5 2.0 2.5 3.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA Normalize@25J
-40 -20 -0 20 40 60 80 100
Forward Voltage@20mA Normalize @25J
2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 100
1.1
1.0
0.9 0.8
Ambient Temperature(J)
Ambient Temperature(J) Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
0X
Relative Intensity@20mA
1.0
-30X
30X
0.5
-60X
60X
0 550 600 650 700
100% 75% 50%
25%
0
25% 50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X Page 6/7
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350XC Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120XC Max Preheat time: 120seconds Max Ramp-up 2XC/sec(max) Ramp-Down:-5XC/sec(max) Solder Bath:260XC Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp(XC) 260XC3sec Max
260X
5X/sec max
120X
2X/sec max Preheat 120 Seconds Max
25X 0X 0
100
200
250
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X Page 7/7
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of hogh temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J&-40JO 5J (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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